加载中…
As integrated circuits continue to scale down, the search for new metals is becoming increasingly important due to the rising resistivity of traditional copper-based interconnects. A layered oxide PdCoO is one of the candidate materials for interconnects, having bulk ab-plane conductivity exceeding that of elemental Al. Despite its potential, wafer-scale vacuum deposition of PdCoO, crucial for interconnect applications, has not yet been reported. In this study, we succeeded in the scalable growth of c-axis oriented PdCoO thin films via reactive sputtering from Pd-Co alloy targets. Our method paves the way to harness the unique properties of PdCoO in semiconductor devices.

生成讲解博客的中文版本

生成AI智能校验的中文版本