Error Source Sensitivity Analysis in Model-Based Coherence Scanning Interferometry for Thin Film Metrology

In semiconductor manufacturing processes, silicon dioxide films are commonly used as barrier layers, insulating layers, and protective layers. Coherence scanning interferometry (CSI) offers thin film thickness measurements with a millimeter-scale field of view and micrometer-scale lateral resolution. When the film thickness is less than the coherence length of a CSI system, a model-based film thickness measurement method is typically employed, which relies on a priori information about the thin film and the instrument. This study quantitatively analyzes how the accuracy of a priori information would affect the accuracy of thickness measurement when using a model-based CSI method. The influence factors include camera noise, numerical aperture (NA), pupil apodization, light source spectrum, and thin film refractive index. A series of SiO${}_2$/Si thin films with varying thicknesses are analyzed by combining simulation and experimental approaches. The results reveal that the accuracy of thickness measurements exhibits varying sensitivity to different a priori information. The refractive index of the thin film is identified as the most sensitive source of error, where 1% deviation in refractive index may cause 1% relative thickness error, whereas 5% deviation in NA results in less than 1% relative thickness error. The simulation and experimental results show good agreement, validating the correctness and effectiveness of this study.