In this work, we address modal parameter fluctuations in statistical distributions describing charge-to-breakdown and/or time-to-breakdown during the dielectric breakdown regime of ultra-thin oxides, which are of high interest for the advancement of electronic technology. We reobtain a generalized Weibull distribution (-Weibull), which properly describes data when oxide thickness fluctuations are present, in order to improve reliability assessment of ultra-thin oxides by time-to-breakdown extrapolation and area scaling. The incorporation of fluctuations allows a physical interpretation of the -Weibull distribution in connection with the Tsallis statistics. In support to our results, we analyze data of SiO-based MOS devices obtained experimentally and theoretically through a percolation model, demonstrating an advantageous description of the dielectric breakdown by the -Weibull distribution.

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