Determination of fracture toughness of thin-film amorphous silicon using spiral crack structures

We prepared thin layers of amorphous silicon by deposition of a liquid-phase polysilane precurser on glass substrate. Raman scattering provides evidence for residual tensile stress in the silicon, which is evaluated quantitatively. Under treatment with hydrofluoric acid, this stress leads to spiral cracks in the silicon. We explain the process of crack formation and examine this phenomenon both analytically and numerically, the latter with the finite element method (FEM). The FEM yields the geometry correction factor for such spiral cracks in terms of the Griffith criterion. This allows for the first time the determination of fracture toughness of amorphous silicon, which is greatly enhanced in comparison with crystalline silicon.