Hybrid 2D/3D photonic integration for non-planar circuit topologies

Complex photonic integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity of the circuit, in particular when it comes to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC that rely on 3D-printed freeform waveguide overpasses (WOP). We experimentally demonstrate the viability of our approach using the example of a $4\times 4$ switch-and-select (SAS) circuit realized on the silicon photonic platform. We further present a comprehensive graph-theoretical analysis of different $n \times n$SAScircuittopologies\mathrm{.}Wefindthatforincreasingportcounts$n$oftheSAScircuit,thenumberofWGXincreaseswith$n^4$, whereas the number of WOP increases only in proportion to $n^2$.