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The upgrade of the current BESIII Endcap TOF (ETOF) is carried out with the Multi-gap Resistive Plate Chamber (MRPC) technology. The installation of the new ETOF has been finished in October 2015. The first results of the MRPCs commissioning at BESIII are reported in this paper.

生成讲解博客的中文版本

生成AI智能校验的中文版本