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We review our recent modelling work of carbon nanotubes as potential candidates for heat dissipation in microelectronics cooling. In the first part, we analyze the impact of nanotube defects on their thermal transport properties. In the second part, we investigate the loss of thermal properties of nanotubes in presence of an interface with various substances, including air and water. Comparison with previous works is established whenever is possible.

生成讲解博客的中文版本

生成AI智能校验的中文版本